After a substrate is loaded into the edge-grip (non vacuum) chuck, the door is closed and the "run" button is pressed. Rinsing fluid (solvents, acids, bases or DI water) can be added through the small hole in the center of the clear lid without fear of splashing. When the substrate is spun dry and the "off" button is pressed, it stops quickly, ready for the next wafer.. If the unit is opened while spinning it will stop safely and will not resume until the door is closed and the "run" button is pressed once again. Note: Many non-vacuum chucks are available

清洗甩干的过程：

当把需要清洗的材料放置在带边角夹具的托盘上（非真空托盘），关上舱门，按下“Run”按钮就开始了清洗。清洗液（水溶液，酸溶液或者双氧水等其它洗剂）可以通过中间的小孔里面注入，不必担心清洗液会喷洒出来。当材料被甩干后，按下“Off”按钮。设备很快地停止下来，这样可以接着清洗下一片材料。舱门的安全联锁机制，使得如果旋涂的过程中，舱门被打开，它能迅速安全地停止，直到确认舱门已经关闭，并再次按下“Run”按钮才可以启动。我们可以提供多种非真空托盘。

So, in small words, you rinse a liquid to clean the wafer and spin at high speed until the wafer is dry. We can deliver such a system with a N2 injector as well, to dry it off but that will cost more. The best system would be our EDC, where you have auto dispense capability of different solvents and dry the wafer with an extra injector. Also the bowl chamber can be washed automatically.

总而言之，可以用洗液一直高速清洗知道材料被甩干。我们的设备可以配合氮气喷嘴一起使用，这样很快就吹干。**的系统是我们的EDC（刻蚀/显影/清洗）一体机，你能采用自动滴胶，然后用附带的喷嘴吹干材料，同时，腔体也能自动被清洗一边。