4300FP - Semi-automatic Wafer Bump Testing

The Nordson DAGE 4300FP eliminates manual hand领 of expensive wafers. It improves cleanliness through isolation of bondtester and wafer handler and increases productivity through semi-automatic testing.

• Shear testing using Nordson DAGE's patented air bearing frictionless intelligent load cell system

• Fully automatic wafer hand领 via customer's third party robot handler (SMIF/FOUP) equipment

• Wafer handler and bondtester can operate in isolated environment with minimum operator interaction

• Joystick manipulation of 100% of wafer surface under test head without repositioning of wafer

• Semi-automatic test routines using 2 reference points (no camera system required) per wafer enable bondtesting to the entire wafer surface without repositioning

• 460mm x 300mm XY stage with robot compatible chuck. Pneumatically operated pins allow wafer exchange using a robot handler

• 360 degree load tool rotation - optional

• Automatic calibration and linearity checks

• Integrated analysis including statistics and SPC functions

• ODBC compliant