研究领域：神经生物医学 交流阻抗频率范围：1MHz - 0.1Hz
This work presents a new fabrication technology for silicon-based neural probe devices and
their assembly into two-dimensional (2D) as well as three-dimensional (3D) microprobe
arrays for neural recording. The fabrication is based on robust double-sided deep reactive ion
etching of standard silicon wafers and allows full 3D control of the probe geometry. Wafer
level electroplating of gold pads was performed to improve the 3D assembly into a platform.
Lithography-based probe-tracking features for quality management were introduced. Probes
for two different assembly methods, namely direct bonding to a flexible micro-cable and
platform-based out-of-plane interconnection, were produced. Systems for acute and
sub-chronic recordings were assembled and characterized. Recordings from rats demonstrated
the recording capability of these devices.
(Some figures in this article are in colour only in the electronic version)
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