法国SET键合机/芯片与芯片键合机/法国set 芯片与晶元键合

ACCμRA OPTO

Applications

• Laser diode, laser bar • VCSEL, photo diode

• LED

• Prisms, lenses, mirrors • Micro assembly 

• Flip-chip bonding, die bonding

• Chip-to-chip, chip-to-substrate bonding 

Specifications

• Accuracy* ±0.5 μm

•Post-bond accuracy: +/- 1 μm 

•Range of force : 20 g to 1 kg

•Temperature up to 400°C 

Independent heating for chip and substrate 

•High resolution vertical movement 

74 mm, resolution 0.01μm Driven by brushless motor